Snapdragon 895 SoC will be Manufactured by Samsung

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Snapdragon 895

Qualcomm is bringing a new successor to the Snapdragon 888 which is likely to be named Snapdragon 895. This latest flagship Snapdragon will be manufactured by TSMC and will likely have a 4nm fabrication. Reportedly Snapdragon 895 will have a Qualcomm X65 5G modem, and the speed on 5G networks will be increased to 10Gbps. The Snapdragon X65 modem also features Qualcomm 5G PowerSave 2.0 power-saving technology. This will significantly reduce the power consumption of the device.

The successor to the SOC Flagship, which seems to be called Snapdragon 895, has an internal Code SM8450. And in more detail, this Snapdragon 895 will use the Kryo 780 CPU which is basically ARMv9 or the latest from ARM. In this Article I’ll give you the detailed information of Snapdragon 895 flagship SoC. So make sure you read full of this article to know the all specs and news of Snapdragon 895 flagship SoC.

Qualcomm Snapdragon 888, which launched in December last year, using Samsung 5nm foundry. There is news that Qualcomm has begun to carefully consider the current 5G chip strategy and will relocate some orders to TSMC.

Previously, a blogger broke the news that Xiaomi will bring the annual flagship with under-screen camera technology in the second half of the year. Not surprisingly, this new product will be equipped with Snapdragon 888 or Snapdragon 888 Pro, and may also be named Snapdragon 888 Plus processor.

Therefore, it is reported that the 5nm Snapdragon 888 produced by TSMC will be available in the second half of the year, but this news was denied by the product director of Xiaomi Redmi. It is confirmed that there is no TSMC version of Snapdragon 888, which means that the Snapdragon 888 chip used in the second half of the year will still be manufactured by Samsung.

Who will launch the first Snapdragon 895 Smartphone?

As usual, after the Snapdragon 888 series, Qualcomm will launch a successor at the end of this year. The name may be Snapdragon 895.

Xiaomi and Lenovo will be one of the first manufacturers to carry this chip. At the same time, evleaks, known as a most trusted leaker who broke the news, previously gave detailed information on the SM8450 chip.

Evan Blass Tweet
Evan Blass Tweet

Since the code name of Snapdragon 888 inside Qualcomm is SM8350, according to the naming convention SM8450 is expected to correspond to a new generation of mobile flagship system single-chip SoC.

According to some sources, US chip giant Qualcomm will launch the next-generation flagship mobile phone system single-chip Snapdragon 895 chip. It will be based on the 4nm process of South Korean chip giant Samsung. Samsung’s process technology not only makes the performance of the Qualcomm Snapdragon series more prominent than before. It also enhances the performance of its own Exynos 2200 processor.

The 4nm LPE mentioned here is actually the third-generation 5nm LPA renamed because there is no performance difference from 4LPE. What makes people wonder is that the general manager of Lenovo’s China mobile phone business department recently broke the news. SM8450 is determined to use TSMC 4nm, but the latest situation is He has deleted the above Weibo and adjusted the wording to say that there are too many black swan incidents caused by the shortage of chip production capacity this year.

There are different possible versions of what has been determined, but what is certain is that the 8450 flagships of Lenovo and Motorola will be in place in winter.

As for Exynos 2200, it is said to integrate AMD RDNA2 GPU technology Support ray tracing, variable frame rate rendering and other technologies on mobile phones. It is also reported that Qualcomm has previously reached a $850 million cooperation agreement with Samsung for mass production of Snapdragon 888 chips.

Qualcomm Snapdragon 888 chip, using 5nm process technology, it is currently the top flagship chip in Android models. Performance exceeds MediaTek’s Dimensity 1200 chip and Huawei’s Kirin 9000 chip Snapdragon 888’s 5G connectivity and e-sports gaming experience, Four aspects of artificial intelligence computing architecture and mobile imaging technology have been greatly improved.

Snapdragon Chip

At the same time, Snapdragon 888 is also Qualcomm’s first flagship system-on-a-chip integrated with a 5G baseband chip. It adopts Hexagon digital signal processor DSP design, which greatly improves the level of artificial intelligence computing. The billion-pixel image signal processor ISP has also improved the camera performance by a large margin, bringing the chip performance of mobile smart phone terminals to the extreme level.

At present, the flagship series of manufacturers such as Xiaomi Mi 11, Samsung, Realme, OPPO, OnePlus, Asus, Red Magic gaming phones are equipped with the Snapdragon 888 SoC processor.

Snapdragon 895 SoC specs

According to the information revealed, Qualcomm’s next-generation chip code-named SM8450 may be named Snapdragon 895. It is manufactured using 4nm process and integrated Snapdragon processor X65 5G modem.

The communication speed of millimeter wave and Sub-6 has been significantly improved, which has higher performance than the previous Snapdragon 888 chip. In terms of architecture, it also uses a new ARM Cortex V9 architecture, which increases energy efficiency by 30%  Performance increased by 10%, image signal processor is Spectra 680; FastConnect 6900 subsystem Will support low energy Bluetooth 5.2 audio technology LE Audio and Wi-Fi 6E; CPU upgrade to Kryo 780.

Snapdragon

The combination of Cortex-X2 super core, Cortex-A710 core and Cortex-A510 energy-saving core may be introduced for the first time. The graphics processor GPU has also changed from the previous Adreno 660 to the new Adreno 730, which has greatly improved image processing.

Snapdragon X65 is also equipped with Qualcomm 5G PowerSave 2.0 technology. This is a new power-saving technology defined based on 3GPP Release 16, which can wake up the signal in the networked state. It can bring better power consumption performance and greatly improve the pain points of high power consumption of existing 5G chips. The golden combination of Snapdragon 895 and Snapdragon X65 is bound to further enhance the product power of 5G flagship phones.

With the improvement of technology, chip companies are also constantly developing chips with high precision and low power consumption. But global chip manufacturers who can achieve 4nm mass production.

TSMC’s 4Nm Process

At present, there are only two players from South Korean chip giant Samsung and Taiwanese chip manufacturer TSMC. Under the influence of the global core shortage, TSMC has accelerated the pace of research and development of new processes. At the 2021 Technology Forum held by TSMC this year, it claimed that the progress of 4nm process research and development is very smooth. It is expected to start trial production in the third quarter of 2021.

TSMC CEO pointed out that the 4nm process they will launch is compatible with the design rules of 5nm process Compared with the 5nm process, it has more cost-effective advantages, and mass production is planned in 2022.

In addition, the director of TSMC’s Advanced Technology Business Development Division stated that due to cost considerations, mid-to-low-end mobile phones. Consumer electronics and other products adopt the most advanced process technology time will be slightly delayed.

At present, most of them adopt 16nm and 12nm and are moving towards 6nm. It is estimated that the mainstream technology of this kind of products will be 4nm by 2023. Although TSMC provides a better process than Samsung, Qualcomm did not cooperate with it this time.

There is speculation that it may be because TSMC’s 4nm process was originally expected to be trial production in the third quarter of 2021 and mass production in 2022. However, recently there has been news that TSMC’s production schedule has been advanced to the fourth quarter, and the first wave of production capacity will be fully covered by Apple.

The 4nm process is used for new Mac products with comprehensive performance enhancements, which makes TSMC miss the cooperation with Qualcomm. It is worth mentioning that Qualcomm’s rival MediaTek. In the 5G era, it adopts Dimensity 720 5G system single-chip new products equipped with 8-core CPU. Dimensity 800 5G chip with flagship 8-core architecture. Dimensity 1000 chips manufactured using 7nm process and Dimensity 2000 chips manufactured using 5nm process will be released soon.

Once reached the first good result of mobile phone system single chip shipments. Especially in the mid-range market, MediaTek has seized a large amount of Qualcomm’s original share, and its market share will even reach 27% in 2020.

The latest report released by an analyst from Tianfeng International pointed out that MediaTek’s 5G system-on-a-chip advantage lies in. It works closely with TSMC to launch chips suitable for mid-range smartphones. But recently, due to the cooperation between TSMC and Apple, it has received a large order for mass production of 4nm process. On the other hand, Apple expects to adopt self-developed 5G baseband chips on the iPhone as soon as 2023.

Therefore, Qualcomm will be forced to fight for more orders in the low-end market to make up for the loss of orders due to Apple, which is not conducive to MediaTek’s production. In the future, the penetration rate of 5G mobile phones will slow down, so the fastest growing period for MediaTek and Qualcomm’s 5G chip business has passed.

Although MediaTek’s market share in the first quarter of this year has reached 50% to 55%, surpassing Qualcomm, but it also means that it has limited room for future growth. In addition, in terms of high-end chips, MediaTek is still unable to replace Qualcomm. From the news revealed this time and Apple’s advance purchase of TSMC’s chips, it can be seen that.

Now that the 4nm process has become a key resource for major manufacturers to compete for, the further refinement of the chip lithography process has also become a major trend in future development. TSMC and Samsung’s 4nm process is still the focus of major technology companies. TSMC temporarily filled the vacancy that lost Huawei due to the influx of Apple orders.

However, if TSMC relies too much on a single manufacturer, it may gradually fall into a disadvantaged position in the future to grab the right to speak in market competition. Especially when the technology of Samsung and other foundry companies gradually overtime, TSMC will rely too much on Apple’s single share, or it will become a restraint. Based on these news, it may be the key reason why Qualcomm handed over the Snapdragon 895 to Samsung’s 4nm process.

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